Following Samsung, SK Hynix develops ‘reusable CMP pad’

Following Samsung, SK Hynix has developed reusable CMP pad technology to flatten semiconductor wafers. Korean media reports that SK Hynix succeeded in developing chemical mechanical polishing (CMP) pad reuse technology. SK Hynix bypassed Samsung Electronics and F&S Tech’s patents and researched its own CMP pad reuse technology. This is a method to reconstruct the worn […]


The post Following Samsung, SK Hynix develops ‘reusable CMP pad’ appeared first on Sammy Fans.


http://dlvr.it/T0cPGj