Samsung could apply MUF material in its next-gen semiconductor

Last month at CES 2024, the South Korean tech giant officially introduced a large lineup of cutting-edge semiconductors Therefore, a new report suggests that Samsung is considering applying new Molded Underfill (MUF)’ material in its next-gen semiconductor packaging. According to the information, Samsung Electronics is planning to introduce MUF material through the silicon electrode (TSV) process. […]


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